How thick is ENIG finish?
The typical thickness ranges from 0.05 – 0 23 µm (2 – 9 µ in) gold over 2.5 – 5.0 µm (100 – 200 µ in) electroless nickel. This thickness remains consistent throughout the PCB.
What is OSP finish?
OSP (Organic Solderability Preservative) OSP is a water-based, organic surface finish that is typically used for copper pads. It selectively bonds to copper and protects the copper pad before soldering. OSP is environmentally friendly, provides a coplanar surface, is lead-free, and requires low equipment maintenance.
Where is the gold on a PCB?
Yes, most cell phones have gold in them. Places where gold may be found in a cell phone include the speakers (gold plated parts), the circuit board and small parts such as gold-plated connector pins and capacitors.
Is ENIG lead free?
ENIG is an answer to major industry trends such as lead-free requirements and rise of complex surface components (especially BGAs and flip chips), which require flat surfaces.
What’s the difference between Enig and hard gold plating?
Generally, the thickness of the ENIG plating is difficult to exceed 5μ” while electroplated gold plating can easily reach a thickness of 15μ ” or more, of which, the price will also increase with the thickness of the gold layer. Flash gold just means rapid gold plating. In fact, it is the pre-process of hard gold plating.
Which is better immersion gold or ENIG surface finish?
The typical thickness ranges from 0.05 – 0 23 µm (2 – 9 µ in) gold over 2.5 – 5.0 µm (100 – 200 µ in) electroless nickel. This thickness remains consistent throughout the PCB. Advantages of Immersion Gold Finish. Although ENIG is an expensive surface finish technology, still it is popular due to the following reasons:
How is electroless nickel immersion gold ( ENIG ) used?
Electroless nickel immersion gold ( ENIG) is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating covered with a thin layer of gold, which protects the nickel from oxidation.
Which is better immersion gold or hard plating?
When considering immersion gold and other options for a circuit board or other applications, consider four different characteristics: Contact force absorption and resistance to wear: Hard plating will perform better against high levels of contact force and wear. Appearance: Hard plating provides a more lustrous surface finish.